STEVEMIT
steve/so-package
Small-outline IC packages by TI outline: SOIC-14/16 and 20W, SSOP-16/20/28, TSSOP-8 and TSSOP-48/56 (6.1 mm body).
steve/son-package
No-lead small-outline IC packages by TI outline: WSON-8/10/12/16, VSON-8 and X1SON-8, 0.4 to 0.8 mm pitch, with exposed thermal pad.
Isometric
Section analysis
Plane normal
Offset
| 1 | """No-lead small-outline IC package (WSON, VSON, DFN) by TI package outline. Centred on the origin with the seating plane on the XY plane, pins 1 to n/2 |
| 2 | on the -Y side running +X, the others on +Y running back, and the exposed thermal pad in the middle. Dimensions from the TI outline named by `package`; see |
| 3 | the README.""" |
| 4 | from steve import Model |
| 5 | |
| 6 | package = "DSQ0010A" # TI package outline |
| 7 | detail = "full" # full: body, pin-1 mark, terminals and thermal pad; simple: the body only |
| 8 | |
| 9 | # outline: (kind, pins, pitch, body length along the pin rows, body width across them, height, standoff, terminal length, terminal width, thermal pad |
| 10 | # across the rows, thermal pad along them, terminal thickness), ranges as (min, max), single values as drawn (thickness is the outline's reference), mm. |
| 11 | # TI package outlines, https://www.ti.com/lit/pdf/<doc>: DSQ0010A mpds335 (4218906/A 04/2019), NGQ0008A mpds403 (4214922/A 03/2018), DNT0012B mpds48 |
| 12 | # (4214928/C 10/2021), NHR0016B mpds42 (4214932/B 08/2025), DRM0008A mpds160 (4218889/A 01/2025), DNX0008A mpds560 (4221623/A 08/2014). Thermal pads are drawn as nominal |
| 13 | # +/-0.1. DNX0008A gives its height as 0.5 maximum only. |
| 14 | OUTLINES = { |
| 15 | "DSQ0010A": ("WSON", 10, 0.4, (1.9, 2.1), (1.9, 2.1), (0.7, 0.8), (0.0, 0.05), (0.2, 0.4), (0.15, 0.25), 0.9, 1.5, 0.2), |
| 16 | "NGQ0008A": ("WSON", 8, 0.5, (2.9, 3.1), (2.9, 3.1), (0.7, 0.8), (0.0, 0.05), (0.3, 0.5), (0.2, 0.3), 1.6, 2.0, 0.1), |
| 17 | "DNT0012B": ("WSON", 12, 0.5, (3.9, 4.1), (3.9, 4.1), (0.7, 0.8), (0.0, 0.05), (0.3, 0.5), (0.2, 0.3), 2.6, 3.0, 0.1), |
| 18 | "NHR0016B": ("WSON", 16, 0.5, (4.9, 5.1), (3.9, 4.1), (0.7, 0.8), (0.0, 0.05), (0.3, 0.5), (0.2, 0.3), 2.6, 4.0, 0.1), |
| 19 | "DNX0008A": ("X1SON", 8, 0.5, (2.9, 3.1), (2.9, 3.1), (0.5, 0.5), (0.0, 0.05), (0.35, 0.45), (0.2, 0.3), 1.65, 2.38, 0.127), |
| 20 | "DRM0008A": ("VSON", 8, 0.8, (3.9, 4.1), (3.9, 4.1), (0.8, 1.0), (0.0, 0.05), (0.3, 0.5), (0.23, 0.38), 2.45, 3.38, 0.1), |
| 21 | } |
| 22 | # The pin-1 mark is a proportion, for looks. |
| 23 | |
| 24 | |
| 25 | def mid(pair): |
| 26 | return (pair[0] + pair[1]) / 2 |
| 27 | |
| 28 | |
| 29 | kind, pins, pitch, L, W, H, standoff, term_l, term_w, pad_x, pad_y, thick = OUTLINES[package] |
| 30 | length, width, top, standoff, term_l, term_w = mid(L), mid(W), mid(H), mid(standoff), mid(term_l), mid(term_w) |
| 31 | per_row = pins // 2 |
| 32 | first = -(per_row - 1) * pitch / 2 |
| 33 | model = Model() |
| 34 | model.plane("body_plane", on="XY", offset=standoff, name="Body") |
| 35 | with model.sketch("body_sketch", on="body_plane", name="Body") as sk: |
| 36 | sk.rect("body_rect", (-length / 2, -width / 2), (length / 2, width / 2)) |
| 37 | model.extrude("body", "body_sketch", distance=top - standoff, name="Body") |
| 38 | if detail == "full": |
| 39 | model.plane("top_plane", on="XY", offset=top, name="Top") |
| 40 | with model.sketch("mark_sketch", on="top_plane", name="Pin-1 mark") as sk: |
| 41 | sk.circle("mark_circle", (-length / 2 + 0.15 * width, -width / 2 + 0.15 * width), 0.05 * width) |
| 42 | model.extrude("mark", "mark_sketch", distance=-0.03, op="cut", name="Pin-1 mark") |
| 43 | for tag, side in (("low", -1), ("high", 1)): |
| 44 | y_out, y_in = side * width / 2, side * (width / 2 - term_l) |
| 45 | with model.sketch(f"terms_{tag}", on="XY", name="Terminals") as sk: |
| 46 | for i in range(per_row): |
| 47 | x = first + i * pitch |
| 48 | sk.rect(f"term_{tag}_{i}", (x - term_w / 2, min(y_in, y_out)), (x + term_w / 2, max(y_in, y_out))) |
| 49 | model.extrude(f"terms_{tag}_body", f"terms_{tag}", distance=thick, name="Terminals") |
| 50 | # the thermal pad's across-the-rows size runs along Y, its along-the-rows size along X |
| 51 | with model.sketch("pad_sketch", on="XY", name="Thermal pad") as sk: |
| 52 | sk.rect("pad_rect", (-pad_y / 2, -pad_x / 2), (pad_y / 2, pad_x / 2)) |
| 53 | model.extrude("pad", "pad_sketch", distance=thick, name="Thermal pad") |
| 54 | model.material("pla", color="#26282b") |
| 55 | result = model.result() |
| 56 |
| 1 | name = "steve/son-package" |
| 2 | version = "1.1.0" |
| 3 | runtime = "steve" |
| 4 | license = "MIT" |
| 5 | summary = "No-lead small-outline IC packages by TI outline: WSON-8/10/12/16, VSON-8 and X1SON-8, 0.4 to 0.8 mm pitch, with exposed thermal pad." |
| 6 | description = """No-lead small-outline IC packages for board layouts: body, pin-1 mark, terminals and exposed thermal pad, each from a named TI package outline. See the README.""" |
| 7 | tags = ["ic-package", "son", "wson", "vson", "x1son", "dfn", "smd", "electronics"] |
| 8 | |
| 9 | [parameters.package] |
| 10 | type = "choice" |
| 11 | default = "DSQ0010A" |
| 12 | choices = ["DSQ0010A", "NGQ0008A", "DNT0012B", "NHR0016B", "DRM0008A", "DNX0008A"] |
| 13 | label = "TI package outline" |
| 14 | |
| 15 | [parameters.detail] |
| 16 | type = "choice" |
| 17 | default = "full" |
| 18 | choices = ["full", "simple"] |
| 19 | label = "Detail" |
| 20 | description = "full: body, pin-1 mark, terminals and thermal pad. simple: the body only." |
| 21 | |
| 22 | [[presets]] |
| 23 | id = "X1SON-8-DNX0008A" |
| 24 | title = "X1SON-8 (DNX0008A), 3x3 mm, 0.5 mm pitch" |
| 25 | params = { package = "DNX0008A" } |
| 26 | aliases = ["X1SON-8", "X1SON8", "8 pin X1SON", "DNX0008A"] |
| 27 | standard = "TI package outline" |
| 28 | |
| 29 | [[presets]] |
| 30 | id = "WSON-10-DSQ0010A" |
| 31 | title = "WSON-10 (DSQ0010A), 2x2 mm, 0.4 mm pitch" |
| 32 | params = { package = "DSQ0010A" } |
| 33 | aliases = ["WSON-10", "WSON10", "10 pin WSON", "DSQ0010A"] |
| 34 | standard = "TI package outline" |
| 35 | |
| 36 | [[presets]] |
| 37 | id = "WSON-8-NGQ0008A" |
| 38 | title = "WSON-8 (NGQ0008A), 3x3 mm, 0.5 mm pitch" |
| 39 | params = { package = "NGQ0008A" } |
| 40 | aliases = ["WSON-8", "WSON8", "8 pin WSON", "NGQ0008A"] |
| 41 | standard = "TI package outline" |
| 42 | |
| 43 | [[presets]] |
| 44 | id = "WSON-12-DNT0012B" |
| 45 | title = "WSON-12 (DNT0012B), 4x4 mm, 0.5 mm pitch" |
| 46 | params = { package = "DNT0012B" } |
| 47 | aliases = ["WSON-12", "WSON12", "12 pin WSON", "DNT0012B"] |
| 48 | standard = "TI package outline" |
| 49 | |
| 50 | [[presets]] |
| 51 | id = "WSON-16-NHR0016B" |
| 52 | title = "WSON-16 (NHR0016B), 4x5 mm, 0.5 mm pitch" |
| 53 | params = { package = "NHR0016B" } |
| 54 | aliases = ["WSON-16", "WSON16", "16 pin WSON", "NHR0016B"] |
| 55 | standard = "TI package outline" |
| 56 | |
| 57 | [[presets]] |
| 58 | id = "VSON-8-DRM0008A" |
| 59 | title = "VSON-8 (DRM0008A), 4x4 mm, 0.8 mm pitch" |
| 60 | params = { package = "DRM0008A" } |
| 61 | aliases = ["VSON-8", "VSON8", "8 pin VSON", "DRM0008A"] |
| 62 | standard = "TI package outline" |
| 63 | |
| 64 | [[presets]] |
| 65 | id = "WSON-10-DSQ0010A-simple" |
| 66 | title = "WSON-10 (DSQ0010A), simple" |
| 67 | params = { package = "DSQ0010A", detail = "simple" } |
| 68 | aliases = ["WSON-10 simple"] |
| 69 | standard = "TI package outline" |
| 70 |
No-lead small-outline package
No-lead small-outline IC packages (WSON, VSON, X1SON), each modelled from a named TI package outline: the body, the terminals along two sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, the others are on +Y running back, and the thermal pad is in the middle.
Source
TI package outlines at https://www.ti.com/lit/pdf/<document>:
| Outline | Package | Body | Pitch | Document | Drawing |
|---|---|---|---|---|---|
| DSQ0010A | WSON-10 | 2 x 2 mm | 0.4 mm | mpds335 | 4218906/A 04/2019 |
| NGQ0008A | WSON-8 | 3 x 3 mm | 0.5 mm | mpds403 | 4214922/A 03/2018 |
| DNT0012B | WSON-12 | 4 x 4 mm | 0.5 mm | mpds48 | 4214928/C 10/2021 |
| NHR0016B | WSON-16 | 4 x 5 mm | 0.5 mm | mpds42 | 4214932/B 08/2025 |
| DRM0008A | VSON-8 | 4 x 4 mm | 0.8 mm | mpds160 | 4218889/A 01/2025 |
| DNX0008A | X1SON-8 | 3 x 3 mm | 0.5 mm | mpds560 | 4221623/A 08/2014 |
Each outline gives body length and width, height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range; DNX0008A gives its height as 0.5 maximum only. The terminal thickness is the outline's reference value.
The thermal pad is the TI outline's. A footprint whose name gives a different pad size, such as DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm against DRM0008A's 2.45 x 3.38 mm, isn't this part even when the body and pitch match.
A footprint name's pad counts as the outline's when each side is within 0.05 mm, since pad labels are rounded. Matched within that: DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm to DNX0008A (1.65 x 2.38 mm).
Proportions, for looks only: the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled.
Other WSON, VSON and DFN sizes and the QFN packages aren't here yet; see COVERAGE.md.
| 1 | # No-lead small-outline package |
| 2 | |
| 3 | No-lead small-outline IC packages (WSON, VSON, X1SON), each modelled from a named TI package outline: the body, the terminals along two sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, the others are on +Y running back, and the thermal pad is in the middle. |
| 4 | |
| 5 | ## Source |
| 6 | |
| 7 | TI package outlines at `https://www.ti.com/lit/pdf/<document>`: |
| 8 | |
| 9 | | Outline | Package | Body | Pitch | Document | Drawing | |
| 10 | |---|---|---|---|---|---| |
| 11 | | DSQ0010A | WSON-10 | 2 x 2 mm | 0.4 mm | mpds335 | 4218906/A 04/2019 | |
| 12 | | NGQ0008A | WSON-8 | 3 x 3 mm | 0.5 mm | mpds403 | 4214922/A 03/2018 | |
| 13 | | DNT0012B | WSON-12 | 4 x 4 mm | 0.5 mm | mpds48 | 4214928/C 10/2021 | |
| 14 | | NHR0016B | WSON-16 | 4 x 5 mm | 0.5 mm | mpds42 | 4214932/B 08/2025 | |
| 15 | | DRM0008A | VSON-8 | 4 x 4 mm | 0.8 mm | mpds160 | 4218889/A 01/2025 | |
| 16 | | DNX0008A | X1SON-8 | 3 x 3 mm | 0.5 mm | mpds560 | 4221623/A 08/2014 | |
| 17 | |
| 18 | Each outline gives body length and width, height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range; DNX0008A gives its height as 0.5 maximum only. The terminal thickness is the outline's reference value. |
| 19 | |
| 20 | The thermal pad is the TI outline's. A footprint whose name gives a different pad size, such as `DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm` against DRM0008A's 2.45 x 3.38 mm, isn't this part even when the body and pitch match. |
| 21 | |
| 22 | A footprint name's pad counts as the outline's when each side is within 0.05 mm, since pad labels are rounded. Matched within that: `DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm` to DNX0008A (1.65 x 2.38 mm). |
| 23 | |
| 24 | **Proportions, for looks only:** the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled. |
| 25 | |
| 26 | Other WSON, VSON and DFN sizes and the QFN packages aren't here yet; see `COVERAGE.md`. |
| 27 |
No-lead small-outline IC packages for board layouts: body, pin-1 mark, terminals and exposed thermal pad, each from a named TI package outline. See the README.
No-lead small-outline package
No-lead small-outline IC packages (WSON, VSON, X1SON), each modelled from a named TI package outline: the body, the terminals along two sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, the others are on +Y running back, and the thermal pad is in the middle.
Source
TI package outlines at https://www.ti.com/lit/pdf/<document>:
| Outline | Package | Body | Pitch | Document | Drawing |
|---|---|---|---|---|---|
| DSQ0010A | WSON-10 | 2 x 2 mm | 0.4 mm | mpds335 | 4218906/A 04/2019 |
| NGQ0008A | WSON-8 | 3 x 3 mm | 0.5 mm | mpds403 | 4214922/A 03/2018 |
| DNT0012B | WSON-12 | 4 x 4 mm | 0.5 mm | mpds48 | 4214928/C 10/2021 |
| NHR0016B | WSON-16 | 4 x 5 mm | 0.5 mm | mpds42 | 4214932/B 08/2025 |
| DRM0008A | VSON-8 | 4 x 4 mm | 0.8 mm | mpds160 | 4218889/A 01/2025 |
| DNX0008A | X1SON-8 | 3 x 3 mm | 0.5 mm | mpds560 | 4221623/A 08/2014 |
Each outline gives body length and width, height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range; DNX0008A gives its height as 0.5 maximum only. The terminal thickness is the outline's reference value.
The thermal pad is the TI outline's. A footprint whose name gives a different pad size, such as DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm against DRM0008A's 2.45 x 3.38 mm, isn't this part even when the body and pitch match.
A footprint name's pad counts as the outline's when each side is within 0.05 mm, since pad labels are rounded. Matched within that: DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm to DNX0008A (1.65 x 2.38 mm).
Proportions, for looks only: the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled.
Other WSON, VSON and DFN sizes and the QFN packages aren't here yet; see COVERAGE.md.
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