# No-lead small-outline package

No-lead small-outline IC packages (WSON, VSON, X1SON), each modelled from a named TI package outline: the body, the terminals along two sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, the others are on +Y running back, and the thermal pad is in the middle.

## Source

TI package outlines at `https://www.ti.com/lit/pdf/<document>`:

| Outline | Package | Body | Pitch | Document | Drawing |
|---|---|---|---|---|---|
| DSQ0010A | WSON-10 | 2 x 2 mm | 0.4 mm | mpds335 | 4218906/A 04/2019 |
| NGQ0008A | WSON-8 | 3 x 3 mm | 0.5 mm | mpds403 | 4214922/A 03/2018 |
| DNT0012B | WSON-12 | 4 x 4 mm | 0.5 mm | mpds48 | 4214928/C 10/2021 |
| NHR0016B | WSON-16 | 4 x 5 mm | 0.5 mm | mpds42 | 4214932/B 08/2025 |
| DRM0008A | VSON-8 | 4 x 4 mm | 0.8 mm | mpds160 | 4218889/A 01/2025 |
| DNX0008A | X1SON-8 | 3 x 3 mm | 0.5 mm | mpds560 | 4221623/A 08/2014 |

Each outline gives body length and width, height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range; DNX0008A gives its height as 0.5 maximum only. The terminal thickness is the outline's reference value.

The thermal pad is the TI outline's. A footprint whose name gives a different pad size, such as `DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm` against DRM0008A's 2.45 x 3.38 mm, isn't this part even when the body and pitch match.

A footprint name's pad counts as the outline's when each side is within 0.05 mm, since pad labels are rounded. Matched within that: `DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm` to DNX0008A (1.65 x 2.38 mm).

**Proportions, for looks only:** the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled.

Other WSON, VSON and DFN sizes and the QFN packages aren't here yet; see `COVERAGE.md`.