steve/qfn-package

Quad flat no-lead IC packages by TI outline: VQFN-20 (0.65 mm pitch) and VQFN-24/32/48/64 (0.5 mm pitch), with exposed thermal pad.

v1.0.0 Latest STEVE MIT 0

Open in STEVE

Isometric

Parameters

Preset6 sizes

TI package outline5 options

Detail

fullsimple

full: body, pin-1 mark, terminals and thermal pad. simple: the body only.

Defaults built

part.py 60 lines · Python · STEVE runtime · checked

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"""Quad flat no-lead IC package (VQFN) by TI package outline. Centred on the origin with the seating plane on the XY plane: terminals along all four sides,

pin 1 at the +Y end of the -X side and counting counter-clockwise seen from above, and the exposed thermal pad in the middle. Dimensions from the TI outline

named by `package`; see the README."""

from steve import Model

package = "RGE0024H" # TI package outline

detail = "full" # full: body, pin-1 mark, terminals and thermal pad; simple: the body only

# outline: (kind, pins, pitch, body size, height max, standoff, terminal length, terminal width, thermal pad size, terminal thickness), bodies and thermal

# pads square, ranges as (min, max), single values as drawn (thickness is the outline's reference), all in mm.

# TI package outlines in TI datasheets, https://www.ti.com/lit/ds/symlink/<part>.pdf: RGE0024H in BQ24166 (SLUSAP4B, 4219016/A 08/2017), RGZ0048A and

# RHB0032E in CC2640R2F (SWRS204C, 4219044/D 02/2022 and 4223442/B 08/2019), RGC0064B in MSP430F5529 (SLAS590P, 4219010/A 10/2018), RGW0020A in TPS7A47

# (SBVS204G, 4219039/A 06/2018). Thermal pads are drawn as nominal +/-0.1. RGC0064B's height is 0.8 to 1.0; the others give 1 maximum.

OUTLINES = {

"RGW0020A": ("VQFN", 20, 0.65, (4.9, 5.1), 1.0, (0.0, 0.05), (0.45, 0.65), (0.26, 0.36), 3.15, 0.1),

"RGE0024H": ("VQFN", 24, 0.5, (3.9, 4.1), 1.0, (0.0, 0.05), (0.28, 0.48), (0.18, 0.30), 2.7, 0.2),

"RHB0032E": ("VQFN", 32, 0.5, (4.9, 5.1), 1.0, (0.0, 0.05), (0.3, 0.5), (0.2, 0.3), 3.45, 0.2),

"RGZ0048A": ("VQFN", 48, 0.5, (6.9, 7.1), 1.0, (0.0, 0.05), (0.3, 0.5), (0.18, 0.30), 5.15, 0.2),

"RGC0064B": ("VQFN", 64, 0.5, (8.85, 9.15), 1.0, (0.0, 0.05), (0.3, 0.5), (0.18, 0.30), 4.25, 0.2),

}

# The pin-1 mark is a proportion, for looks.

def mid(pair):

return (pair[0] + pair[1]) / 2

kind, pins, pitch, size, top, standoff, term_l, term_w, pad, thick = OUTLINES[package]

size, standoff, term_l, term_w = mid(size), mid(standoff), mid(term_l), mid(term_w)

per_side = pins // 4

first = -(per_side - 1) * pitch / 2

half = size / 2

model = Model()

model.plane("body_plane", on="XY", offset=standoff, name="Body")

with model.sketch("body_sketch", on="body_plane", name="Body") as sk:

sk.rect("body_rect", (-half, -half), (half, half))

model.extrude("body", "body_sketch", distance=top - standoff, name="Body")

if detail == "full":

model.plane("top_plane", on="XY", offset=top, name="Top")

with model.sketch("mark_sketch", on="top_plane", name="Pin-1 mark") as sk:

sk.circle("mark_circle", (-half + 0.1 * size, half - 0.1 * size), 0.04 * size)

model.extrude("mark", "mark_sketch", distance=-0.05, op="cut", name="Pin-1 mark")

with model.sketch("terms_x", on="XY", name="Terminals") as sk:

for i in range(per_side):

y = first + i * pitch

sk.rect(f"term_west_{i}", (-half, y - term_w / 2), (-half + term_l, y + term_w / 2))

sk.rect(f"term_east_{i}", (half - term_l, y - term_w / 2), (half, y + term_w / 2))

model.extrude("terms_x_body", "terms_x", distance=thick, name="Terminals")

with model.sketch("terms_y", on="XY", name="Terminals") as sk:

for i in range(per_side):

x = first + i * pitch

sk.rect(f"term_south_{i}", (x - term_w / 2, -half), (x + term_w / 2, -half + term_l))

sk.rect(f"term_north_{i}", (x - term_w / 2, half - term_l), (x + term_w / 2, half))

model.extrude("terms_y_body", "terms_y", distance=thick, name="Terminals")

with model.sketch("pad_sketch", on="XY", name="Thermal pad") as sk:

sk.rect("pad_rect", (-pad / 2, -pad / 2), (pad / 2, pad / 2))

model.extrude("pad", "pad_sketch", distance=thick, name="Thermal pad")

model.material("pla", color="#26282b")

result = model.result()

"""Quad flat no-lead IC package (VQFN) by TI package outline. Centred on the origin with the seating plane on the XY plane: terminals along all four sides,
pin 1 at the +Y end of the -X side and counting counter-clockwise seen from above, and the exposed thermal pad in the middle. Dimensions from the TI outline
named by `package`; see the README."""
from steve import Model

package = "RGE0024H"  # TI package outline
detail = "full"  # full: body, pin-1 mark, terminals and thermal pad; simple: the body only

# outline: (kind, pins, pitch, body size, height max, standoff, terminal length, terminal width, thermal pad size, terminal thickness), bodies and thermal
# pads square, ranges as (min, max), single values as drawn (thickness is the outline's reference), all in mm.
# TI package outlines in TI datasheets, https://www.ti.com/lit/ds/symlink/<part>.pdf: RGE0024H in BQ24166 (SLUSAP4B, 4219016/A 08/2017), RGZ0048A and
# RHB0032E in CC2640R2F (SWRS204C, 4219044/D 02/2022 and 4223442/B 08/2019), RGC0064B in MSP430F5529 (SLAS590P, 4219010/A 10/2018), RGW0020A in TPS7A47
# (SBVS204G, 4219039/A 06/2018). Thermal pads are drawn as nominal +/-0.1. RGC0064B's height is 0.8 to 1.0; the others give 1 maximum.
OUTLINES = {
    "RGW0020A": ("VQFN", 20, 0.65, (4.9, 5.1), 1.0, (0.0, 0.05), (0.45, 0.65), (0.26, 0.36), 3.15, 0.1),
    "RGE0024H": ("VQFN", 24, 0.5, (3.9, 4.1), 1.0, (0.0, 0.05), (0.28, 0.48), (0.18, 0.30), 2.7, 0.2),
    "RHB0032E": ("VQFN", 32, 0.5, (4.9, 5.1), 1.0, (0.0, 0.05), (0.3, 0.5), (0.2, 0.3), 3.45, 0.2),
    "RGZ0048A": ("VQFN", 48, 0.5, (6.9, 7.1), 1.0, (0.0, 0.05), (0.3, 0.5), (0.18, 0.30), 5.15, 0.2),
    "RGC0064B": ("VQFN", 64, 0.5, (8.85, 9.15), 1.0, (0.0, 0.05), (0.3, 0.5), (0.18, 0.30), 4.25, 0.2),
}
# The pin-1 mark is a proportion, for looks.


def mid(pair):
    return (pair[0] + pair[1]) / 2


kind, pins, pitch, size, top, standoff, term_l, term_w, pad, thick = OUTLINES[package]
size, standoff, term_l, term_w = mid(size), mid(standoff), mid(term_l), mid(term_w)
per_side = pins // 4
first = -(per_side - 1) * pitch / 2
half = size / 2
model = Model()
model.plane("body_plane", on="XY", offset=standoff, name="Body")
with model.sketch("body_sketch", on="body_plane", name="Body") as sk:
    sk.rect("body_rect", (-half, -half), (half, half))
model.extrude("body", "body_sketch", distance=top - standoff, name="Body")
if detail == "full":
    model.plane("top_plane", on="XY", offset=top, name="Top")
    with model.sketch("mark_sketch", on="top_plane", name="Pin-1 mark") as sk:
        sk.circle("mark_circle", (-half + 0.1 * size, half - 0.1 * size), 0.04 * size)
    model.extrude("mark", "mark_sketch", distance=-0.05, op="cut", name="Pin-1 mark")
    with model.sketch("terms_x", on="XY", name="Terminals") as sk:
        for i in range(per_side):
            y = first + i * pitch
            sk.rect(f"term_west_{i}", (-half, y - term_w / 2), (-half + term_l, y + term_w / 2))
            sk.rect(f"term_east_{i}", (half - term_l, y - term_w / 2), (half, y + term_w / 2))
    model.extrude("terms_x_body", "terms_x", distance=thick, name="Terminals")
    with model.sketch("terms_y", on="XY", name="Terminals") as sk:
        for i in range(per_side):
            x = first + i * pitch
            sk.rect(f"term_south_{i}", (x - term_w / 2, -half), (x + term_w / 2, -half + term_l))
            sk.rect(f"term_north_{i}", (x - term_w / 2, half - term_l), (x + term_w / 2, half))
    model.extrude("terms_y_body", "terms_y", distance=thick, name="Terminals")
    with model.sketch("pad_sketch", on="XY", name="Thermal pad") as sk:
        sk.rect("pad_rect", (-pad / 2, -pad / 2), (pad / 2, pad / 2))
    model.extrude("pad", "pad_sketch", distance=thick, name="Thermal pad")
model.material("pla", color="#26282b")
result = model.result()

pypart.toml 63 lines · TOML

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name = "steve/qfn-package"

version = "1.0.0"

runtime = "steve"

license = "MIT"

summary = "Quad flat no-lead IC packages by TI outline: VQFN-20 (0.65 mm pitch) and VQFN-24/32/48/64 (0.5 mm pitch), with exposed thermal pad."

description = """Quad flat no-lead IC packages for board layouts: body, pin-1 mark, terminals on four sides and exposed thermal pad, each from a named TI package outline. See the README."""

tags = ["ic-package", "qfn", "vqfn", "smd", "electronics"]

[parameters.package]

type = "choice"

default = "RGE0024H"

choices = ["RGW0020A", "RGE0024H", "RHB0032E", "RGZ0048A", "RGC0064B"]

label = "TI package outline"

[parameters.detail]

type = "choice"

default = "full"

choices = ["full", "simple"]

label = "Detail"

description = "full: body, pin-1 mark, terminals and thermal pad. simple: the body only."

[[presets]]

id = "VQFN-20-RGW0020A"

title = "VQFN-20 (RGW0020A), 5x5 mm, 0.65 mm pitch"

params = { package = "RGW0020A" }

aliases = ["VQFN-20", "VQFN20", "QFN-20", "20 pin VQFN", "RGW0020A"]