# Quad flat no-lead package

Quad flat no-lead IC packages (VQFN), each modelled from a named TI package outline: the body, the terminals along all four sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pin 1 is at the +Y end of the -X side, and the pins count counter-clockwise seen from above.

## Source

TI package outlines, printed in the TI datasheets at `https://www.ti.com/lit/ds/symlink/<part>.pdf`:

| Outline | Package | Body | Pitch | Thermal pad | Datasheet | Drawing |
|---|---|---|---|---|---|---|
| RGW0020A | VQFN-20 | 5 x 5 mm | 0.65 mm | 3.15 mm | TPS7A47, SBVS204G | 4219039/A 06/2018 |
| RGE0024H | VQFN-24 | 4 x 4 mm | 0.5 mm | 2.7 mm | BQ24166, SLUSAP4B | 4219016/A 08/2017 |
| RHB0032E | VQFN-32 | 5 x 5 mm | 0.5 mm | 3.45 mm | CC2640R2F, SWRS204C | 4223442/B 08/2019 |
| RGZ0048A | VQFN-48 | 7 x 7 mm | 0.5 mm | 5.15 mm | CC2640R2F, SWRS204C | 4219044/D 02/2022 |
| RGC0064B | VQFN-64 | 9 x 9 mm | 0.5 mm | 4.25 mm | MSP430F5529, SLAS590P | 4219010/A 10/2018 |

Each outline gives body size, maximum height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range, and the height is the 1 mm maximum, so read it as an envelope. The terminal thickness is the outline's reference value.

The thermal pad is the TI outline's. A footprint whose name gives a pad more than 0.05 mm different from it isn't this part, even when the body and pitch match; within 0.05 mm counts as rounding. Every model matched here names the outline's pad exactly. Thin and extra-thin QFNs (TQFN, WQFN) and other pad sizes aren't matched.

**Proportions, for looks only:** the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled.

Other QFN sizes aren't here yet, and DFN/SON packages are the `son-package` part; see `COVERAGE.md`.