STEVEMIT
steve/fh12-fpc-connector
Hirose FH12 0.5 mm pitch FPC/FFC connectors, right angle, bottom contact, flip lock, 6 to 53 contacts, by the maker's drawing.
STEVEMIT
steve/molded-chip-inductor
Power molded chip inductors in the Würth WE-PMCI sizes, 1.6 x 0.8 mm to 3.2 x 2.5 mm, by the maker's datasheets.
STEVEMIT
steve/flat-wire-inductor
Shielded SMD flat-wire high-current inductors in the Würth WE-HCM sizes, 7 x 7 mm to 13.3 x 13.5 mm, by the maker's datasheets.
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steve/high-current-inductor
Shielded high-current SMD power inductors in the Würth WE-HCI sizes, 5.3 x 5.6 mm to 22 x 22.5 mm, by the maker's datasheets.
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steve/alloy-power-inductor
Shielded metal-alloy SMD power inductors in the Würth WE-MAPI sizes, 2.0 x 1.6 mm to 4.1 x 4.1 mm, by the maker's datasheets.
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steve/dip-switch-smd
Surface-mount slide DIP switches in the Omron A6S (2.54 mm, 1 to 10 poles) and A6H (1.27 mm, 2 to 10 poles) sizes.
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steve/wirewound-power-inductor
Wire-wound shielded SMD power inductors in the Sunlord SWPA sizes, 2.5 x 2.0 mm to 8 x 8 mm, by the maker's dimension table.
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steve/molded-power-inductor
Molded SMD power inductors in the Sunlord MWSA-S sizes, 4.2 x 4.4 mm to 22 x 23.5 mm, by the maker's dimension table.
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steve/qfn-package
Quad flat no-lead IC packages by TI outline: VQFN-20 (0.65 mm pitch) and VQFN-24/32/48/64 (0.5 mm pitch), with exposed thermal pad.
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steve/son-package
No-lead small-outline IC packages by TI outline: WSON-8/10/12/16, VSON-8 and X1SON-8, 0.4 to 0.8 mm pitch, with exposed thermal pad.
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steve/sot-package
Small-outline transistor packages by TI outline: SOT-23, thin SOT-23-5/6/8, SC-70-3/6, SOT-553 and SOT-563.
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steve/so-package
Small-outline IC packages by TI outline: SOIC-14/16 and 20W, SSOP-16/20/28, TSSOP-8 and TSSOP-48/56 (6.1 mm body).
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steve/tssop-package
TSSOP package, 4.4 mm body, 0.65 mm pitch: 14, 16, 20 and 24 pins.