STEVEMIT
steve/qfn-package
Quad flat no-lead IC packages by TI outline: VQFN-20 (0.65 mm pitch) and VQFN-24/32/48/64 (0.5 mm pitch), with exposed thermal pad.
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steve/son-package
No-lead small-outline IC packages by TI outline: WSON-8/10/12/16, VSON-8 and X1SON-8, 0.4 to 0.8 mm pitch, with exposed thermal pad.
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steve/sot-package
Small-outline transistor packages by TI outline: SOT-23, thin SOT-23-5/6/8, SC-70-3/6, SOT-553 and SOT-563.
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steve/so-package
Small-outline IC packages by TI outline: SOIC-14/16 and 20W, SSOP-16/20/28, TSSOP-8 and TSSOP-48/56 (6.1 mm body).
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steve/tssop-package
TSSOP package, 4.4 mm body, 0.65 mm pitch: 14, 16, 20 and 24 pins.
STEVEMIT
steve/dip-package
Plastic dual-in-line package (PDIP), 300 mil rows: 14, 16, 18 and 20 pins.