STEVEMIT
steve/bga-package
Ball grid array IC packages by TI outline: DSBGA die-size BGAs, MicroStar Junior BGAs and a 289-ball plastic BGA, each solder ball its own solid.
Ball grid array IC packages by TI outline: DSBGA die-size BGAs, MicroStar Junior BGAs and a 289-ball plastic BGA, each solder ball its own solid.