# No-lead small-outline package

No-lead small-outline IC packages (WSON, VSON), each modelled from a named TI package outline: the body, the terminals along two sides and the exposed thermal pad underneath. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, the others are on +Y running back, and the thermal pad is in the middle.

## Source

TI package outlines at `https://www.ti.com/lit/pdf/<document>`:

| Outline | Package | Body | Pitch | Document | Drawing |
|---|---|---|---|---|---|
| DSQ0010A | WSON-10 | 2 x 2 mm | 0.4 mm | mpds335 | 4218906/A 04/2019 |
| NGQ0008A | WSON-8 | 3 x 3 mm | 0.5 mm | mpds403 | 4214922/A 03/2018 |
| DNT0012B | WSON-12 | 4 x 4 mm | 0.5 mm | mpds48 | 4214928/C 10/2021 |
| NHR0016B | WSON-16 | 4 x 5 mm | 0.5 mm | mpds42 | 4214932/B 08/2025 |
| DRM0008A | VSON-8 | 4 x 4 mm | 0.8 mm | mpds160 | 4218889/A 01/2025 |

Each outline gives body length and width, height, standoff, terminal length and width, and the thermal pad's size. The model uses the middle of each range. The terminal thickness is the outline's reference value.

The thermal pad is the TI outline's. A footprint whose name gives a different pad size, such as `DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm` against DRM0008A's 2.45 x 3.38 mm, isn't this part even when the body and pitch match.

**Proportions, for looks only:** the pin-1 mark on top. The thermal pad's chamfered pin-1 corner isn't modelled.

Other WSON, VSON and DFN sizes and the QFN packages aren't here yet; see `COVERAGE.md`.