# Small-outline package

Small-outline IC packages (SOIC, SSOP, TSSOP), each modelled from a named TI package outline. The package is centred on the origin with the seating plane on the XY plane. Pins 1 to n/2 are on the -Y side running +X, and the others are on +Y running back.

## Source

TI package outlines at `https://www.ti.com/lit/pdf/<document>`:

| Outline | Package | Document | Drawing |
|---|---|---|---|
| D0014A | SOIC-14 | mpds177 | 4220718/A 09/2016 |
| D0016A | SOIC-16 | mpds43 | 4214828/B 08/2021 |
| DW0020A | SOIC-20, wide | mpds173 | 4220724/A 05/2016 |
| DB0016A | SSOP-16 | mpds507 | 4220763/A 05/2022 |
| DB0020A | SSOP-20 | mpds508 | 4214851/B 08/2019 |
| DB0028A | SSOP-28 | mpds510 | 4214853/B 03/2018 |
| PW0008A | TSSOP-8 | mpds568 | 4221848/A 02/2015 |
| DGG0048A | TSSOP-48 | mpds583 | 4214859/B 11/2020 |
| DGG0056A | TSSOP-56 | mpds570 | 4222167/A 07/2015 |

Each outline gives body length and width, lead tip to tip, maximum height, standoff, lead width and foot length. The model uses the middle of each range, and the height is the maximum, so read it as an envelope. The SSOP outlines give a 0.05 minimum standoff only; 0.25 is taken as its upper end.

**Proportions, for looks only:** the gull wing's bend heights and the pin-1 mark. Lead thickness is the outlines' 0.15 reference.

The 4.4 mm TSSOPs with 14 to 24 pins are the `tssop-package` part. Other sizes, SOIC-8 and exposed-pad packages aren't here yet; see `COVERAGE.md`.