name = "steve/bga-package"
version = "1.0.0"
runtime = "steve"
license = "MIT"
summary = "Ball grid array IC packages by TI outline: DSBGA die-size BGAs, MicroStar Junior BGAs and a 289-ball plastic BGA, each solder ball its own solid."
description = """Ball grid array IC packages for board layouts and enclosures: the body and every solder ball, from a named TI package outline (DSBGA YKA0006, YZP0008 and YZP0010, MicroStar Junior GQE and ZQW, and the ZAV plastic BGA). Ball A1 is at the -X, +Y corner. See the README."""
tags = ["ic-package", "bga", "dsbga", "wcsp", "smd", "electronics"]

[parameters.package]
type = "choice"
default = "YZP0010"
choices = ["YKA0006", "YZP0008", "YZP0010", "GQE", "ZQW", "ZAV"]
label = "TI package outline"

[[presets]]
id = "DSBGA-6-YKA0006"
title = "DSBGA 6 (YKA0006), 0.757x1.01 mm, 2x3, 0.35 mm pitch"
params = { package = "YKA0006" }
aliases = ["DSBGA-6 0.757x1.01mm", "YKA0006"]
standard = "TI package outline"

[[presets]]
id = "DSBGA-8-YZP0008"
title = "DSBGA 8 (YZP0008), 0.888x1.888 mm, 2x4, 0.5 mm pitch"
params = { package = "YZP0008" }
aliases = ["DSBGA-8 0.888x1.888mm", "YZP0008"]
standard = "TI package outline"

[[presets]]
id = "DSBGA-10-YZP0010"
title = "DSBGA 10 (YZP0010), 1.36x1.86 mm, 3x4, 0.5 mm pitch"
params = { package = "YZP0010" }
aliases = ["DSBGA-10 1.36x1.86mm", "YZP0010"]
standard = "TI package outline"

[[presets]]
id = "BGA-80-GQE"
title = "MicroStar Junior BGA 80 (GQE), 5x5 mm, 9x9, 0.5 mm pitch"
params = { package = "GQE" }
aliases = ["BGA-80 5x5mm", "GQE"]
standard = "TI package outline"

[[presets]]
id = "BGA-113-ZQW"
title = "MicroStar Junior BGA 113 (ZQW), 7x7 mm, 12x12, 0.5 mm pitch"
params = { package = "ZQW" }
aliases = ["BGA-113 7x7mm", "ZQW"]
standard = "TI package outline"

[[presets]]
id = "BGA-289-ZAV"
title = "BGA 289 (ZAV), 15x15 mm, 17x17, 0.8 mm pitch"
params = { package = "ZAV" }
aliases = ["BGA-289 15x15mm", "ZAV"]
standard = "TI package outline"