# Ball grid array package

Ball grid array IC packages, each modelled from a named TI package outline: the body and every solder ball, each ball its own solid. The package is centred on the origin with the seating plane on the XY plane. Seen from above, ball A1 is at the -X, +Y corner, columns 1, 2, ... run along +X and rows A, B, ... along -Y. Rows are lettered without I, O, Q and S, as TI letters them.

| Outline | Kind | Balls | Grid | Pitch | Body (E x D) |
|---|---|---:|---|---|---|
| YKA0006 | DSBGA | 6 | 2 x 3 | 0.35 mm | 0.757 x 1.01 mm |
| YZP0008 | DSBGA | 8 | 2 x 4 | 0.5 mm | 0.888 x 1.888 mm |
| YZP0010 | DSBGA | 10 | 3 x 4, no B2 or C2 | 0.5 mm | 1.36 x 1.86 mm |
| GQE | MicroStar Junior BGA | 80 | 9 x 9, no C3 | 0.5 mm | 5 x 5 mm |
| ZQW | MicroStar Junior BGA | 113 | 12 x 12, 31 left out | 0.5 mm | 7 x 7 mm |
| ZAV | plastic BGA | 289 | 17 x 17 | 0.8 mm | 15 x 15 mm |

ZQW leaves out C4 to C10, K3 to K10, columns 3 and 10 of rows D to J, and F6, F7, G6 and G7.

## Source

TI package outline drawings, from ti.com:

- ZAV (S-PBGA-N289), "MECHANICAL DATA", `https://www.ti.com/lit/pdf/mpbg777`, page 1, drawing 4208156/A 08/06.
- ZQW (S-PBGA-N113), "MECHANICAL DATA", `https://www.ti.com/lit/pdf/mpbg674`, page 1, drawing 4204599-3/D 08/12.
- GQE/ZQE (S-PBGA-N80), in the TLV320AIC23B datasheet (SLWS106H), Appendix A, page A-1, drawing 4200461/C 10/00: `https://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf`.
- YZP0010, in the TS3A24159 datasheet (SCDS238H, revised August 2022), page 34, drawing 4219350/B 11/2017: `https://www.ti.com/lit/ds/symlink/ts3a24159.pdf`.
- YZP0008, in the TXB0102 datasheet (SCES641E, revised October 2023), page 36, drawing 4223082/A 07/2016: `https://www.ti.com/lit/ds/symlink/txb0102.pdf`.
- YKA0006, in the TPS62843 datasheet (SLVSFU8C, revised June 2024), page 36, drawing 4223607/B 06/2023: `https://www.ti.com/lit/ds/symlink/tps62843.pdf`.

| Outline | D | E | Height | Body thickness | Standoff A1 | Ball |
|---|---|---|---|---|---|---|
| YKA0006 | 0.98–1.04 | 0.727–0.787 | 0.35–0.40 | | 0.13–0.18 | 0.19–0.24 |
| YZP0008 | 1.858–1.918 | 0.858–0.918 | 0.5 max | | 0.15–0.19 | 0.21–0.25 |
| YZP0010 | 1.83–1.89 | 1.33–1.39 | 0.5 max | | 0.15–0.19 | 0.21–0.25 |
| GQE | 4.90–5.10 | 4.90–5.10 | 1.00 max | 0.62–0.68 | 0.11–0.21 | 0.25–0.35 |
| ZQW | 6.90–7.10 | 6.90–7.10 | 1.00 max | 0.71–0.77 | 0.15–0.25 | 0.25–0.35 |
| ZAV | 14.90–15.10 | 14.90–15.10 | 1.40 max | 0.84–0.96 | 0.35–0.45 | 0.45–0.55 |

The model uses the middle of each range. The DSBGA outlines dimension the overall height (YZP as a maximum only) but not the die, so the die runs from the standoff to that height: 0.5 for YZP0008 and YZP0010, 0.375 for YKA0006. The other outlines give the body's thickness, and the body sits on the standoff.

**Proportions, stated plainly.** The drawings show these but don't dimension them:

- Each ball is a sphere of the ball diameter standing on the seating plane, cut flat where it meets the body at the standoff. Every standoff is more than the ball's radius, so the ball's widest point is below the body.
- The ball A1 mark is a dimple on top, 0.03 deep (less on thin dies), of radius 0.05 x the body's shorter side, 0.12 x that side in from the A1 corner.
- Materials are for looks and a rough mass. A DSBGA is the bare die, silicon. The moulded packages are epoxy compound on a laminate substrate, mostly silica filler (density about 1.9 to 2.0), and ptfe (2.2) is the nearest in the material list. The balls are tin-silver-copper solder, so tin.

**Mass.** The outlines give no weight, so there is nothing to check the mass against.

## Catalogue models

Six Texas_* names map, each to the outline with the same balls, grid, pitch and body. The size in the name is TI's nominal E x D (YZP0008's 0.888 x 1.888 is named 0.9x1.9):

- `Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm`: YKA0006.
- `Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm`: YZP0008.
- `Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm`: YZP0010.
- `Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm`: GQE.
- `Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm`: ZQW.
- `Texas_BGA-289_15x15mm_Layout17x17_P0.8mm`: ZAV.

Measured on those six reference models: each has the outline's grid, pitch and body, and the same balls left out. Their balls are within 0.05 of TI's middle diameter, but every model is taller than TI's maximum height, by 0.007 to 0.131. The models are plainly wrong in height, so the outlines are followed:

| Model | Ball (model / TI) | Standoff (model / TI) | Height (model / TI) |
|---|---|---|---|
| DSBGA-6 | 0.225 / 0.215 | about 0.15 / 0.155 | 0.407 / 0.375 (0.40 max) |
| DSBGA-8 0.9x1.9 | 0.21 / 0.23 | about 0.17 / 0.17 | 0.507 / 0.5 max |
| DSBGA-10 | 0.241 / 0.23 | about 0.17 / 0.17 | 0.631 / 0.5 max |
| MicroStar Junior 80 | 0.315 / 0.30 | about 0.21 / 0.16 | 1.010 / 0.81 (1.00 max) |
| MicroStar Junior 113 | 0.315 / 0.30 | about 0.21 / 0.20 | 1.010 / 0.94 (1.00 max) |
| BGA-289 | 0.525 / 0.50 | about 0.41 / 0.40 | 1.415 / 1.30 (1.40 max) |

The other Texas_* names stay open until their outline is read: the 12-ball DSBGAs (YZT, whose outline TXB0104 and TXS0104E no longer print, and YZG, whose D and E TSC2007's current datasheet no longer prints), the 49-ball YFF (MSP430F22x4 gives only D and E), the 8-ball YBJ (no outline in INA234's datasheet), the 12-ball MicroStar Junior (GXU/ZXU) and the 48-ball Junior DSBGA, which names no package code. The other makers' and generic BGA names are not read yet; see `COVERAGE.md`.